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data sheet rev. 1.02 / may 2012 zssc3026 low power, high resolution 16bit sensor signal con ditioner
zssc3026 low power 16 bit sensor signal conditioner ic ? 2012 zmd ag rev. 1.02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. the information furnished in this publication is preliminary and subject to changes without notice. brief description the zssc3026 is a sensor signal conditioner (ssc) integrated circuit for highaccuracy ampli fication and analogtodigital conversion of a diff er ential input signal. designed for high resolution altimeter module applications, the zssc3026 can perform offset, span, and 1 st and 2 nd order temperature compensation of the measured signal. developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. the measured and corrected bridge values are provided at the digital output pins, which can be configured as i 2 c* ( 3.4mhz) or spi ( 20mhz). digital compensation of signal offset, sensitivity, temperature, and nonlinearity is accomplished via an 18bit internal digital signal processor (dsp) running a correction algorithm. calibration coeffic i ents are stored onchip in a highly reliable, non volatile, multipletime programmable (mtp) mem ory. programming the zssc3026 is simple via the serial interface. the icinternal charge pump provides the mtp programming voltage. the interface is used for the pccontrolled calibration procedure, which programs the set of calibration coefficients in memory. the digital mating is fast and precise, eliminating the overhead normally associated with trimming external components and multipass calibration routines. features ? flexible, programmable analog frontend design; up to 16bit scalable, chargebalancing twosegment analogtodigital converter (adc) ? fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor) ? internal autocompensated temperature sensor ? digital compensation of individual sensor offset; 1 st and 2 nd order digital compensation of sensor gain ? digital compensation of 1 st and 2 nd order tem perature gain and offset drift ? intelligent power management unit ? layout customized for diedie bonding with sensor for highdensity chiponboard assembly ? typical sensor elements can achieve accuracy of less than 0.10% fso @ 40 to 110c * i 2 c is a registered trademark of nxp. benefits ? integrated 18bit calibration math dsp ? fully corrected signal at digital output ? minimize calibration costs through the onepass calibration concept ? no external trimming components required ? highly integrated cmos design ? excellent for lowvoltage and lowpower battery applications physical characteristics ? supply voltage range: 1.8 to 3.6v ? current consumption: 1ma (operating mode) ? sleep state current: 50na (typical) ? temperature resolution: <0.003k/lsb ? operation temperatures: C40c to +85c C40c to +110c ? small die size: 1.5mm2 ? delivery options: die for wafer bonding, bumped die for flip chip, pqfn24 typical applications the zssc3026 is designed for operation in calibrated resistive (pressure) sensor modules: ? barometric altitude measurement for portable navigation ? altitude measurement for emergency call systems ? altitude measurement for car navigation ? inside hard disk pressure measurement ? weather forecast ? fan control zssc3026 application example.
zssc3026 low power 16 bit sensor signal conditioner ic ? 2012 zmd ag rev. 1.02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. zssc3026 block diagram ordering information ordering examples * description package ZSSC3026CC1B temperature range: C40c to +85 c, consumerlevel: parameter according data sheet chips, wafer (304um) unsawn, tested zssc3026ci1b temperature range: C40c to +85 c, industriallevel: 10 years mtpdata retention chips, wafer (304um) unsawn, tested zssc3026ci4 temperature range: C40c to +110 c, i ndustrial pqfn24 4x4, tested zssc30x6kit evaluation kit for zssc30x6 product fami ly boards, cable, softwarecd, 1 sample * please contact zmdi sales for additional options. sales and further information www.zmdi.com sales@zmdi.com zentrum mikroelektronik dresden ag grenzstrasse 28 01109 dresden germany zmd america, inc. 8413 excelsior drive suite 200 madison, wi 53717 usa zentrum mikroelektronik dresden ag, japan office 2nd floor, shinbashi tokyu bldg. 4213, shinbashi, minatoku tokyo, 1050004 japan zmd far east, ltd. 3f, no. 51, sec. 2, keelung road 11052 taipei taiwan phone +49 (0)351.8822.7.772 fax +49 (0)351.8822.87.772 phone +1 (608) 8291987 fax +1 (631) 5492882 phone +81.3.6895.7410 fax +81.3.6895.7301 phone +886.2.2377.8189 fax +886.2.2377.8199 disclaimer : this information applies to a product under devel opment. its characteristics and specifications are preliminary and subject to change without notice. zentrum mikroelektronik dresden ag (zmd ag) assumes no obli gation regarding future manufacture unless otherwis e agreed to in writing. the information furnished h ereby is believed to be true and accurate. however, under no circumstances shall zmd ag be liable to any customer, licensee, or any other third party for any special, indirect, incid ental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. zmd ag hereby expressly disclaims any liability of zmd ag to any customer, licensee or any other third party, and any such customer, licensee and any other thir d party hereby waives any liability of zmd ag for a ny damages in connection with or arising out of the furnishing, performance or use o f this technical data, whether based on contract, w arranty, tort (including negligence), strict liabil ity, or otherwise
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 4 of 46 table of contents 1 ic characteristics ................................. ................................................... ................................................... ... 7 1.1. absolute maximum ratings........................... ................................................... ...................................... 7 1.2. operating conditions............................... ................................................... ............................................ 7 1.3. electrical parameters .............................. ................................................... ............................................ 8 1.4. power supply rejection ratio vs. frequency ......... ................................................... .......................... 10 2 circuit description ................................ ................................................... ................................................... . 11 2.1. brief description .................................. ................................................... .............................................. 11 2.2. signal flow and block diagram ...................... ................................................... .................................. 11 2.3. analog front end ................................... ................................................... ........................................... 12 2.3.1. amplifier .......................................... ................................................... ............................................ 12 2.3.2. analogtodigital converter ........................ ................................................... ................................ 14 2.3.3. temperature measurement ............................ ................................................... ............................ 17 2.3.4. bridge supply...................................... ................................................... ........................................ 17 2.4. digital section.................................... ................................................... ................................................ 17 2.4.1. digital signal processor (dsp) core ................ ................................................... .......................... 17 2.4.2. mtp memory ......................................... ................................................... ..................................... 17 2.4.3. clock generator.................................... ................................................... ...................................... 18 2.4.4. power supervision .................................. ................................................... .................................... 18 2.4.5. interface .......................................... ................................................... ............................................ 18 3 functional description............................. ................................................... ................................................. 19 3.1. power up........................................... ................................................... ................................................ 19 3.2. measurements....................................... ................................................... ............................................ 19 3.3. operational modes .................................. ................................................... .......................................... 19 3.4. command interpretation............................. ................................................... ....................................... 21 3.4.1. spi/i2c commands ................................... ................................................... ................................. 21 3.5. communication interface ............................ ................................................... ...................................... 23 3.5.1. common functionality ............................... ................................................... ................................. 23 3.5.2. spi ................................................ ................................................... .............................................. 25 3.5.3. i 2 c .................................................. ................................................... ............................................. 27 3.6. memory............................................. ................................................... ................................................. 28 3.6.1. programming memory ................................. ................................................... ............................... 28 3.6.2. memory status commands ............................. ................................................... ........................... 29 3.6.3. memory contents.................................... ................................................... .................................... 30 3.7. calibration sequence ............................... ................................................... ......................................... 36 3.7.1. calibration step 1 C assigning unique identificatio n.................................................. ................... 36 3.7.2. calibration step 2 C data collection............... ................................................... ............................ 36 3.7.3. calibration step 3 C coefficient calculations ...... ................................................... ....................... 37 3.8. the calibration math ............................... ................................................... .......................................... 37 3.8.1. bridge signal compensation ......................... ................................................... ............................. 37
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 5 of 46 3.8.2. temperature signal compensation .................... ................................................... ........................ 40 4 die dimensions and pin assignments ................. ................................................... .................................... 41 4.1. package (pqfn24) properties........................ ................................................... .................................. 43 5 quality and reliability............................ ................................................... ................................................... 44 6 related documents.................................. ................................................... ................................................ 45 7 glossary ........................................... ................................................... ................................................... ..... 45 8 document revision history.......................... ................................................... ............................................ 46 table of figures figure 2.1 zssc3026 functional block diagram.................. ................................................... ...................... 11 figure 2.2 adc offset......................................... ................................................... ......................................... 16 figure 3.1 operational flow chart: power up. .................. ................................................... .......................... 20 figure 3.2 operational flow chart: command mode and normal mod e. ................................................. ..... 21 figure 3.3 spi configuration cpha=0. .......................... ................................................... .............................. 25 figure 3.4 spi configuration cpha=1. .......................... ................................................... ............................. 25 figure 3.5 spi command request................................ ................................................... .............................. 26 figure 3.6 spi read status. ................................... ................................................... ..................................... 26 figure 3.7 spi read data...................................... ................................................... ...................................... 26 figure 3.8 i 2 c command request.................................. ................................................... ............................ 27 figure 3.9 i2c read status. .................................. ................................................... ..................................... 27 figure 3.10 i 2 c read data........................................ ................................................... ..................................... 28 figure 3.11 memory program operation. .......................... ................................................... ............................ 29 figure 4.1 zssc3026 pad placement............................. ................................................... ............................ 41 figure 4.2 general pqfn24 package dimensions. ................. ................................................... ................... 43 list of tables table 1.1 maximum ratings. ................................... ................................................... ..................................... 7 table 1.2 operating conditions. .............................. ................................................... ..................................... 7 table 1.3 constraints for vdd poweron reset................. ................................................... .......................... 7 table 1.4 electrical parameters. ............................. ................................................... ..................................... 8 table 2.1 amplifier gain: stage 1............................ ................................................... ................................... 12 table 2.2 amplifier gain: stage 2............................ ................................................... ................................... 12 table 2.3 gain polarity. ..................................... ................................................... ......................................... 13 table 2.4 msb/lsb settings. .................................. ................................................... ................................... 14 table 2.5 adc conversion times for a single a2d conversion... ................................................... .............. 14 table 2.6 conversion times vs. noise performance for 16bit fu lly signal conditioned results (azbm, bm, aztm, tm and digital ssc correction). .. ................................................... .............. 15 table 2.7 adc offset settings. ............................... ................................................... ................................... 16 table 3.1 spi/i2c commands................................... ................................................... ................................. 22
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 6 of 46 table 3.2 get_raw commands. .................................. ................................................... .............................. 23 table 3.3 general status byte. ............................... ................................................... ................................... 24 table 3.4 status byte for read operations.................... ................................................... ............................ 24 table 3.5 status byte for write operations. .................. ................................................... ............................. 24 table 3.6 mode status........................................ ................................................... ........................................ 24 table 3.7 memory status word................................. ................................................... ................................. 29 table 3.8 mtp memory content assignments..................... ................................................... ...................... 30 table 4.1 die size & geometry. ............................... ................................................... .................................. 41 table 4.2 pin assignments. ................................... ................................................... ..................................... 42 table 4.3 physical package dimensions extrema. .............. ................................................... ..................... 43 table 4.4 pin assignments pqfn24............................. ................................................... ............................. 44
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 7 of 46 1 ic characteristics 1.1. absolute maximum ratings table 1.1 maximum ratings. parameter symbol min typ max units voltage reference vss 0 0 v analog supply voltage v dd 0.4 3.63 v voltage at all analog and digital io pins v a_io , v d_io 0.5 v dd +0.5 v input current into any pin except sda, clk 1 and supply pins 2 i in 100 100 ma electrostatic discharge tolerance C human body mode l (hbm1) 3 v hbm1 4000 v storage temperature t stor 50 125 c 1 latchup current limit for clk/sclk and mosi/sda: 70ma. 2 latchup resistance; reference for pin is 0v. 3 hbm1: c = 100pf charged to v hbm1 with resistor r = 1.5k in series based on mil 883, method 3015.7. esd protection referring to the human body model is tested with de vices in ceramic dual inline packages (cdip) durin g product qualification. 1.2. operating conditions reference for all voltages is vss. table 1.2 operating conditions. parameter symbol min typ max unit supply voltage v dd 1.8 3.6 v vdd rise time t vdd 200 s bridge current i vddb 600 a operation temperature range* t amb 40 125 c external capacitance between vddb and vss cl 0.01 50 nf * temperature sensors operation and output only u p to 110c (for respective ic version). in order to achieve minimum current consumption in idle mode, a dynamic poweronreset circuit is impl emented. the vdd low level and the subsequent rise time and vdd rising slope have to fulfill specific constrain ts to guarantee an overall ic reset, respectively. generally it holds: lower vdd low levels allow for slower rising of the subsequent onramp of vdd. the following table shows the relevant reset parameters and condi tions. other combinations may also be possible. the reset trigger can be influenced by increasing the power d own time and relaxing, e.g. the vdd rising slope re quirement. table 1.3 constraints for vdd power-on reset. parameter symbol min typ max unit power down time (duration of vdd low level) t spike 3 s vdd low level vdd low 0 0.2 v vdd rising slope sr vdd 10 v/ms
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 8 of 46 1.3. electrical parameters all parameter values are valid only under specified operating conditions. all voltages are referenced to vss. table 1.4 electrical parameters. parameter symbol conditions/comments min typ max unit supply bridge supply voltage, adc reference voltage v ddb internally generated 1.60 1.67 1.74 v active state, average 900 1500 a sleep state, idle current, <85c 20 250 na current consumption i vdd sleep state, idle current, <125c 50 950 na where v dd = 1.8v 17 db power supply rejection (see figure 3.1 ) 20log 10 (v dd /v ddb ) psr vdd where v dd = 2v 32 db memory program voltage v dd,prog required voltage level at vddpin 2.9 3.6 v mean program current i vdd,prog mean current consumption during mtp programming cycle at vdd 6 ma peak program current i prog,max mtp program at vddpin, dynamic switchon current draw 20 ma analog to digital converter (adc) resolution r adc 10 16 bit adc clock frequency f adc internal adc clock 0.925 1 1.12 mhz reference voltage n v refn v ddb *0.03 reference voltage p v refp v ddb *0.97 offset a2d_offset 8step programmable offset 1/16 8/16 integral nonlinearity (inl) inl adc based on ideal slope 4 +4 lsb differential nonlinearity dnl adc tested / verified within design 1 +1 lsb conversion rate, 16bit single f s,raw conversions per second for single 16bit a2d conversion 6 355 hz amplifier gain g amp 32 steps 13.2 72 gain error g err referred to nominal gain 1.5 1.5 % sensor signal conditioning performance ic accuracy error err a,ic accuracy error for ideally linear (in temperature and e.g. pressure) sensor 0.01 %fso * * percentage referred to maximum fullscale output, e.g. for 16bit measurements: err a,ic [%fso] = 100 max{ | adc meas C adc ideal | } / 2 16
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 9 of 46 parameter symbol conditions/comments min typ max unit conversion rate, 16bit ssc f s, ssc conversion per second for fully corrected 16bit measurement 3 175 hz input input voltage range v inp , v inn input voltage range at inp and inn 0.65 1.05 v bridge resistance r br 2 10 50 k power up t sta1 v dd ramp up to interface communication 1 ms startup time t sta2 v dd ramp up to analog operation 2.5 ms t wup1 sleep to active state interface communication 0.5 ms wakeup time t wup2 sleep to active state analog operation 2 ms oscillator internal oscillator frequency f clk 3.6 4 4.4 mhz internal temperature sensor temperature resolution for both ranges: 40c to +85c 40c to +110c 0.003 k/lsb interface and memory spi clock frequency f c,spi max. capacitance at misoline: 40pf @ v dd =1.8v 20 mhz i2c clock frequency f c,i2c 3.4 mhz program time t prog mtp programming time per register 500 600 s data retention t ret_mtp for industriallevel icversion: 1000h @ 125c 10 * a * with maximum ambient temperature of 125c
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 10 of 46 1.4. power supply rejection ratio vs. frequency
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 11 of 46 2 circuit description 2.1. brief description the zssc3026 provides a highlyaccurate amplificati on of bridge sensor signals. the compensation of se nsor offset, sensitivity, temperature drift, and nonlin earity is accomplished via an 18bit dsp core runni ng a correction algorithm with calibration coefficients stored in a n mtp memory. the zssc3026 can be configured for a wide range of resistive bridge sensor types. a digital i nterface (spi or i 2 c) enables communication. the zssc3026 supports two operational modes: normal mode and command mode . normal mode is supposed to be the mode being used typically, in which the ic wakes up from a sleep (low power) state, runs a measurement in a ctive state and turns back automatically to the sleep sta te. 2.2. signal flow and block diagram see figure 2.1 for the zssc3026 block diagram. the sensor bridge supply v ddb and the power supply for analog circuitry are provided by a voltage regulator, whic h is optimized for power supply disturbance rejecti on (psrr). see section 1.4 for a graph of psrr versus frequenc y. to improve noise suppression, the digital blocks are powered by a separate voltage regulator. a power su pervision circuit monitors all supply voltages and generates appropriate reset signals for initializing the digi tal blocks. the state machine controls the analog circuitry to perform the three measurement types: bridge, temper ature, and offset measurement. the multiplexer selects the sig nal input to the amplifier, which can be the extern al signals from the input pins inp and inn, the internal tempe rature reference sensor signals, or an input short for measuring offset. a full measurement request will t rigger an automatic sequence of all measurement typ es and all input signals, respectively. the temperature refere nce sensor block is based on a ptat temperature sen sor. the inherit (icfabrication related) device mismatc h is suppressed by dynamic element matching techniq ue. figure 2.1 zssc3026 functional block diagram.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 12 of 46 the amplifier consists of two stages with programma ble gain values. the 1/f noise and inherent offset are suppressed by autozero and chopper stabilizer tech niques. this autozero sequence is performed before each bridge sensor and temperature measurement to compen sate for the inherent offset of the amplifier. the zssc3026 employs a chargebalancing analogtod igital converter (adc) based on switchedcapacitor technique with inherit lowpass behavior and noise suppression. the programmable resolution from 10 to 16 bit provides flexibility for adapting the conversion ch aracteristics. to improve power supply noise suppre ssion, the adc uses the bridge supply v ddb as its reference voltage. the remaining icinternal and the sensor element of fset i.e., the overall system offset (amplifier and adc) can be canceled by an offset and autozero measurement, re spectively. the dsp accomplishes the autozero, span, and 1 st and 2 nd order temperature compensation of the measured bridge signal. the correction coefficients are stor ed in the mtp memory. the zssc3026 supports spi and i 2 c interface communication for controlling, configur ation and measurement result output. 2.3. analog front end 2.3.1. amplifier the amplifier has a differential architecture and c onsists of two stages. the amplification of each st age and the sensor bridge gain polarity are programmable via se ttings in the measurement configuration register ( bm_config ) in the mtp memory (see section 2.4.2). the first five bits of bm_config are the programmable gain settings gain_stage1 and gain_stage2 . the options for the programmable gain settings are listed in ta ble 2.1 and table 2.2. table 2.1 amplifier gain: stage 1. gain_stage1 bit g1 bit g0 stage 1 gain setting 0 0 12 0 1 20 1 0 30 1 1 40 table 2.2 amplifier gain: stage 2. gain_stage2 bit g4 bit g3 bit g2 stage 2 gain setting 0 0 0 1.1 0 0 1 1.2 0 1 0 1.3 0 1 1 1.4
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 13 of 46 gain_stage2 bit g4 bit g3 bit g2 stage 2 gain setting 1 0 0 1.5 1 0 1 1.6 1 1 0 1.7 1 1 1 1.8 if needed, the polarity of the sensor bridge gain c an be reversed by setting the gain_polarity bit in the bm_config register (see section 2.4.2). changing the gain pol arity is achieved by inverting the chopper clock. t able 2.3 gives the settings for the gain_polarity bit. this feature enables to apply a sensor to the zssc3026 with swapped input signals at inn and inp e.g., to avoid crossing wire s for the final sensor modules assembly. table 2.3 gain polarity. gain_polarity bit gain setting description 0 +1 no polarity change. 1 1 gain polarity is inverted. the inherent amplifier offset is suppressed by mean s of auto zero and chopper techniques.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 14 of 46 2.3.2. analog-to-digital converter a secondorder chargebalancing analogtodigital c onverter (adc) is used to convert the amplifier signal. to allow optimizing the tradeoff between conversion t ime and resolution, the conversion is split into a msb coarse conversion and an lsb fine conversion. the msblsb segmentation is programmable via the msb and lsb settings in the bm_config register stored in the mtp memory (see section 2.4 .2). the final adc resolution is determined by msb+lsb. the conversion time is propo rtional to 2 msb +2 lsb . during the msb coarse conversion, the adc input signal is sampled and integrated 2 msb times, resulting in inherit lowpass behavior and noise suppression; here it holds: the longer the msb coar se conversion, the better the noise suppression. po ssible settings are listed in table 2.4. table 2.4 msb/lsb settings. msb setup bits in bm_config number of msb coarse conversion bits lsb setup bits in bm_config number of lsb fine conversion bits 00 bin 10 00 bin 0 01 bin 12 01 bin 2 10 bin 14 10 bin 4 11 bin 16 11 bin 7 useful msb/lsb setups are with lsb = 0 (msbonly co nversions) or combinations of msb > lsb with msb + lsb 16. resolutions beyond 16bit mainly di gitize the collected frontend noise and typically do not improve the system performance. msb/lsb segmentatio ns with lsb > msb are also not useful because typic ally the resolution remains the same as with the inverse msb/lsb segmentation but the noise performance bec omes significantly worse yet the required conversion tim e stays the same. the adc conversion times for diff erent msb/lsb settings are listed in table 2.5. table 2.5 adc conversion times for a single a2d con version. msb [bit] lsb [bit] bridge & temperature measurement conversion time in s 10 0 1169 12 0 4625 14 0 18449 16 0 73745 10 2 1176 12 2 4632 14 2 18456 10 4 1200 12 4 4656 10 6 1296
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 15 of 46 table 2.6 conversion times vs. noise performance fo r 16bit fully signal conditioned results (azbm, bm, aztm, tm and digital ssc correction). adc segmentation: temperature sensor [msb/lsb] adc segmentation: bridge sensor [msb/lsb] measurement duration, measure (ac hex ) [ms] 3-sigma noise for ssc- corrected output ? [counts] 10 / 6 10 / 6 5.8 8.6 10 / 6 12 / 4 13.2 6.4 10 / 6 14 / 2 43.0 5.8 10 / 6 16 / 0 164.1 5.6 12 / 4 * 10 / 6 13.2 8.4 12 / 4 * 12 / 4 20.5 6.4 12 / 4 * 14 / 2 50.5 5.6 12 / 4 * 16 / 0 170.3 5.1 14 / 2 10 / 6 43.0 7.6 14 / 2 12 / 4 50.5 5.9 14 / 2 14 / 2 80.7 4.4 14 / 2 16 / 0 200.3 4.4 16 / 0 10 / 6 162.6 6.9 16 / 0 12 / 4 170.3 5.4 16 / 0 14 / 2 200.3 4.1 16 / 0 16 / 0 319.5 4.0 ? reference noise values obtained with setup: 13.7ko hm sensor bridge, 25c, gain=64, adcshift=1/1615 /16, vdd=1.8v . * zmdirecommendation for temperature sensor measure ments adc segmentation.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 16 of 46 the adc offset is programmable in 8 steps so that t he adc input voltage range can be adapted to the vo ltage range at the input pins inp and inn. possible adc i nput voltages are shown in figure 2.2, where v agnd = v ddb /2. the adc offset is controlled by the a2d_offset setting in the measurement configuration register ( bm_config ) in the mtp memory (see section 2.4.2). the adc offset settings are listed in table 2.7. figure 2.2 adc offset. table 2.7 adc offset settings. z2 z1 z0 adc differential input range/v ref where v ref = v refp - v refn a2d_offset 0 0 0 1/16 to 15/16 1/16 0 0 1 2/16 to 14/16 2/16 0 1 0 3/16 to 13/16 3/16 0 1 1 4/16 to 12/16 4/16 1 0 0 5/16 to 11/16 5/16 1 0 1 6/16 to 10/16 6/16 1 1 0 7/16 to 9/16 7/16 1 1 1 8/16 to 8/16 8/16
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 17 of 46 2.3.3. temperature measurement the zssc3026 provides an internal temperature senso r measurement to allow compensation for temperature effects. see section 1.3 for the temperature sensor resolution. the temperature sensor uses bipolar tr ansistors. any transistor circuitry mismatch is suppressed by dynamic element matching technique. the temperature output signal is a differential voltage that is adapted by the amplifier for the adc input. for temperature measurements, the adc offset and am plifier gain setting are defined by zmdi. the adc msb/lsb segmentation is programmable by the user fo r optimizing resolution or conversion time (see sec tion 2.3.2). 2.3.4. bridge supply the zssc3026 provides dedicated bridge supply pins vddb and vssb. the adc reference voltages for the sensor bridge measurement are derived from these in ternal voltages so that bridge supply disturbances are suppressed. the current drive ability of v ddb is limited (see i vddb in section 1.2). 2.4. digital section 2.4.1. digital signal processor (dsp) core the dsp core block performs the algorithm for corre cting the sensor signal. the resulting coefficients are stored in the mtp memory. when the measurement results are available, the "end of conversion" signal is set a t the eoc pin. the internal eoc information is valid only if both the measurement and calculation have been completed. 2.4.2. mtp memory the zssc3026s memory is designed with an otp (one time programmable) structure. the memory is organiz ed in 4 onetime programmable pages. when data in the currently valid memory page has to be updated, norm ally a new page must be selected by increasing the page co unter and the whole memory content has to be writte n in its updated version. the user has access to a 24 x 16 b it storage area for values such as calibration coef ficients. dedicated calibration values are stored in an area not accessible to the user. the required programmin g voltage is generated icinternally whereas increased ic pow er supply requirements have to be fulfilled during programming (see memory programming voltage in sect ion 1.3). there is no overwrite or erase function for the mtp memory. the physical memory function is such that each sing le bit which has not yet been set to 1 (so, still b eing 0) can be changed to 1, still. so, it is possible to (partial ly) reprogram an mtpregister, e.g.: ? assume mtpaddress 11 hex was written with 8421 hex which is 1000 0100 0010 0001 binary . ? due to whatever reason there would be the need to change the register content to a6a7 hex which is 1010 0110 1010 0111 binary . this can be achieved by either writing a6a7 hex (any already written bit will be ignored automatically) or just writing the diffe rence to 8421 hex , which is 2286 hex . the content of a rewritten register can generally be determined by: content register = content old (bitwise_or) content new . if content register equals content new , a rewrite is possible C this is, e.g. not the ca se for content old = ffff hex and content new ffff hex . or, in other words, depending on the former and t he newly intended mtpaddress and register content a reprogramming could be possible .
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 18 of 46 2.4.3. clock generator the clock generator provides a 4mhz clock signal. t he frequency is trimmed during production test. 2.4.4. power supervision the power supervision block monitors all power supp lies to ensure a defined reset of all digital block s during powerup or power supply interruptions. 2.4.5. interface the zssc3026 can communicate with the users pc via an spi or i 2 c interface * . the interface type is selectable via the voltage level on the sel pin: ? sel = 0 > spi mode ? sel = 1 > i 2 c mode if the sel pin is not connected, i2c communication will be selected (icinternal pullup at sel pin). further, the spispecific pins (like: ss, miso) do not need to b e connected at all for i2c operation. to also provide interface accessibility in sleep st ate (all ic features inactive except for the digita l interface logic), the interface circuitry is directly supplied by vdd . *. functional i 2 c interface properties correspond to the nxp i2c bu s specification rev. 0.3 (june 2009) .
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 19 of 46 3 functional description 3.1. power up specifications for this section are given in sectio ns 1.2 and 1.3. on powerup, the zssc3026 communica tion interface is able to receive the first command afte r a time t sta1 from when the vdd supply is within operating specifications. the zssc3026 can begin the first me asurement after a time of t sta2 .from when the vdd supply is operational. the wake up time from sleep state to active state a fter receiving the activating command is defined as t wup1 and t wup2 . in command mode, subsequent commands can be sent after t wup1 . the first measurement starts after t wup2 if measurement request was sent. 3.2. measurements available measurement procedures are ? azbm: autozero bridge measurement ? bm: bridge measurement ? aztm: autozero temperature measurement ? tm: temperature measurement azbm: the configuration for bridge measurements is loade d. the multiplexer connects the amplifier input to the agnd analog ground reference. an analogtodigital conversion is performed so that the inherent system offset for the bridge configuration is converted by the ad c to a 16bit digital word. bm: the configuration for bridge measurements is loade d. the multiplexer connects the amplifier input to the bridge pins: inp and inn. an analogtodigital conv ersion is performed. the result is a 16bit digital word. aztm: the configuration for temperature measurements is loaded. the multiplexer connects the amplifier inpu t to agnd. an analogtodigital conversion is perform ed so that the inherent system offset for the tempe rature configuration is converted by the adc to a 16bit d igital word. tm: the configuration for temperature measurements is loaded. the multiplexer connects the amplifier inpu t to the internal temperature sensor. an analogtodigit al conversion is performed. the result is a 16bit digital word. the typical applications measurement cycle is a co mplete sscmeasurement (using the command: ac hex ) with azbm, bm, aztm, tm followed by a signal correction calculation. 3.3. operational modes figure 3.1 illustrates the zssc3026 powerup sequen ce and subsequent operation depending on the select ed interface communication mode (i 2 c or spi). with either interface, after the voltage regulators are switched on, the zssc3026s low voltage section (lv) is active while the related interface configuration information is read from memory. then the lv section is switched off, the zs sc3026 goes into sleep state, and the interface is ready to receive commands. since the interface is always pow ered by v dd , it is referred to as the high voltage section (hv). figure 3.2 shows the zssc3026 operation in normal m ode and command mode including when the lv and hv sections are active as indicated by the color legen d. the normal mode automatically returns to sleep s tate after executing the requested measurements. in command mo de, the zssc3026 remains active if a dedicated command (start_nom) was sent, which is helpful duri ng calibration. command mode can only be entered if start_cm is the very first command after por.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 20 of 46 data/status from lv data/status from lv figure 3.1 operational flow chart: power up.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 21 of 46 figure 3.2 operational flow chart: command mode and normal mode. 3.4. command interpretation 3.4.1. spi/i2c commands the useraccessible section of memory includes addr esses 00 hex through 17 hex in the otp memory that is designated by the user memory page pointer. because each of the four otp memory pages cannot be rewrit ten or erased, the memory page pointer must be incremen ted to the next otp memory page in order to write t o memory again (see table 3.1 for the command). after all four useraccessible otp memory pages have bee n used, further write operations are not possible and the memory full bit is returned as set in the st atus byte after write operations (see section 3.5.1). the spi/i 2 c commands supported by the zssc3026 are listed in table 3.1. the command to read an address in the user memory is the same as its address. the com mand to read the 16bit memory status of the data a t an address in user memory is the address plus 20 hex . the command to write to an address in user memory is the address plus 40 hex .
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 22 of 46 there is a zmdireserved section of memory, which c an be read but not overwritten by the user. table 3.1 spi/i2c commands. command (byte) returns * description normal mode command mode 00 hex to 17 hex 16bit user data read data in user memory address matching command (addresses 00 hex to 17 hex ; might not be using all addresses). yes yes 20 hex to 37 hex 16bit user memory status read memory status for address specified by command minus 20 hex (addresses 00 hex to 17 hex respectively; see section 3.6.2 for a description of the memory status). yes yes 40 hex to 57 hex + data (0000 hex to ffff hex ) write data to user memory at address specified by command minus 40 hex (addresses 00 hex to 17 hex respectively; might not be using all addresses). no yes 70 hex to 7e hex 16bit zmdireserved memory data read data in zmdireserved memory at address specified by command minus 70 hex (2 nd set of addresses 00 hex to 0e hex respectively). no yes 80 hex to 8e hex 16bit zmdireserved memory status read memory status bytes for zmdi reserved memory data at address specified by command minus 80 hex (2 nd set of addresses 00 hex to 0e hex respectively; see section 3.6.2 for a description of the memory status bytes). no yes 5e hex increment user memory page pointer. no yes a0 hex to a7 hex + xxxx hex (see table 3.2) 16bit wide raw data get_raw this command can be used to perform a measurement and write the raw adc data into the output register. the lsb of the command determines how the afe configuration register is loaded for the get_raw measurement (see table 3.2). yes yes a8 hex start_nom exit command mode and transition to normal mode. no yes a9 hex start_cm exit normal mode and transition to command mode. yes no aa hex write_checksumc if not yet written, the checksum for the valid user mtp page is calculated and written to mtp. the vpp voltage must be applied before, during, and after this command. no yes ac hex 16bit fully corrected bridge measurement data + 16bit corrected internal temperature measure triggers full measurement cycle (azbm, bm, aztm, tm, as described in sec tion 3.2) and calculation and storage of data in interface (configurations from mtp). yes yes fx hex status + last data nop only valid for spi (see section 3.5.1). yes yes * every response starts with a status byte followed by the data word as described in section 3.5.1.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 23 of 46 table 3.2 get_raw commands. command measurement afe configuration register a0 hex + 0000 hex bm C bridge measurement bm_config a1 hex + ssss hex bm C bridge measurement ssss is the users config uration setting for the measurement provided via the interface. the format and purpose of configuration bits must be equal to the definitions for bm_config . a2 hex + 0000 hex bmazbm C autozero corrected bridge measurement 1) bm_config a3 hex + ssss hex bmazbm C autozero corrected bridge measurement 2) ssss is the users configuration setting for the measurement provided via the interface. the format and purpose of configuration bits must be equal to the definitions for bm_config . a4 hex + 0000 hex tm C temperature measurement zmdidefined registe r a5 hex + ssss hex tm C temperature measurement ssss is the users c onfiguration setting for the measurement provided via the interface. the format and purpose of configuration bits must be equal to the definitions for bm_config being valid for temp. measurement in this case (bits [15:13] will be ignored). a6 hex + 0000 hex tmaztm C autozero corrected temperature measurement 1) zmdidefined register a7 hex + ssss hex tmaztm C autozero corrected temperature measurement 2) ssss is the users configuration setting for the measurement provided via the interface. the format and purpose of configuration bits must be equal to the definitions for bm_config being valid for temp. measurement in this case (bits [15:13] will be ignored). 1) recommended for raw data collection during calibra tion coefficient determination using preprogrammed (in mtp) measurement setups 2) recommended for raw data collection during calibra tion coefficient determination using unprogrammed (not in mtp), external measurement setups, e.g. for evaluation purposes 3.5. communication interface 3.5.1. common functionality commands are handled by the command interpreter in the lv section. commands which need additional data are not treated differently than other commands because the hv interface is able to buffer the command and all data that belongs to the command, and the command interp reter is activated as soon as a command byte is rec eived. every response starts with a status byte followed b y the data word. the data word depends on the previ ous command. it is possible to read the same data more than once if the read request is repeated (i 2 c) or a nop command is sent (spi). if the next command is not a read request (i2c) or a nop (spi), it invalidates any previous data.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 24 of 46 the status byte contains the following bits (see ta ble 3.3, table 3.4, and table 3.5 for sequence): ? power indication (bit 6): 1 if the device is powere d (v ddb on); 0 if not powered. this is needed for spi mode where the master reads all zeros if the device is n ot powered or in poweron reset (por). ? busy indication (bit 5): 1 if the device is busy, w hich indicates that the data for the last command i s not available yet. no new commands are processed if the device is busy. ? actual zssc3026 mode (bits 4:3): 00 = normal mode; 01 = command mode; 1x = zmdireserved. ? memory integrity/error flag (bit 2): 0 if integrity test passed, 1 if test failed. this bit indicates whether the checksumbased integrity check passed or failed. co rrectable errors are not reported but can be querie d with the memory status commands (see section 3.6.2) . the memory error status bit is calculated only during the powerup sequence, so a newly written cr c will only be used for memory verification and sta tus update after a subsequent ic poweron reset (por). ? data transfer/correction (bit 1): if the last comma nd was a memory write, this bit is 0 if the last me mory write was successful (memory not full yet), otherwi se it is 1 (e.g. page increase but being already on last mtp page). if the last command was a memory read, t his bit is 1 if the data was corrected. table 3.3 general status byte. bit 7 6 5 4 3 2 1 0 meaning 0 powered? busy? mode memory error? data transfer s pecial table 3.4 status byte for read operations. bit 7 6 5 4 3 2 1 0 meaning 0 powered? busy? mode memory error? data corrected? alu saturation? table 3.5 status byte for write operations. bit 7 6 5 4 3 2 1 0 meaning 0 powered? busy? mode memory error? memory full? mtp write reject? dont care table 3.6 mode status. status[4:3] mode 00 normal mode 01 command mode 10 zmdireserved 11 command mode and reserved the memory error status bit is only calculated duri ng the powerup sequence, so a newly written crc wi ll only be used for memory verification after a subsequent pow eron reset (por). further status information are provided by the eoc pin. the eoc pin is set high when a measurement and calculation have been completed.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 25 of 46 msb sclk (cpol=0) bit6 bit5 bit4 bit3 bit2 bit1 lsb msb bit6 bit5 bit4 bit3 bit2 bit1 lsb sclk (cpol=1) mosi miso /ss sample cpha=0 msb sclk (cpol=0) bit6 bit5 bit4 bit3 bit2 bit1 lsb msb bit6 bit5 bit4 bit3 bit2 bit1 lsb sclk (cpol=1) mosi miso /ss sample cpha=1 3.5.2. spi the spi mode is available when the sel pin = 0. the polarity (controlled by cpol bit) and the phase (c ontrolled by cpha bit) of the spi clock ( ckp_cke) and the polarity of the ss signal ( ss_polarity) are programmable as described in table 3.8. ckp_cke is two bits: cpha, which selects which edge of sclk latches data, and cpol which indicates whether sclk is high or low when it is idle. the different combinations of polarity an d phase are illustrated in the figures below. figure 3.3 spi configuration cpha=0. figure 3.4 spi configuration cpha=1. in spi mode, each command except nop is started as shown in figure 3.5. after the execution of a comma nd (busy = 0), the expected data can be read as illust rated in figure 3.6 or if no data are returned by t he command, the next command can be send. the status can be rea d at any time with the nop command (see figure 3.7
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 26 of 46 cmddat <15:8> cmddat <7:0> command other than nop status data data command request mosi miso note: a command request always consists of 3 bytes . if the command is shorter, then it must be comple ted with 0s. the data on miso depend on the preceding c ommand. command = nop status read status mosi miso status memdat <15:8> memdat <7:0> bridgedat <15:8> bridgedat <7:0> tempdat <15:8> tempdat <7:0> command = nop 00 hex 00 hex status command = nop 00 hex 00 hex 00 hex 00 hex read data mosi (a) example: after the completion of a memory read command miso (b) example: after the completion of a full measur ement command (ac hex ) mosi miso figure 3.5 spi command request. figure 3.6 spi read status. figure 3.7 spi read data.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 27 of 46 s slaveaddr a 0 command a p s slaveaddr 0 a command a cmddat <15:8> a cmddat <7:0> a p command request (i 2 c write) write write from master to slave from slave to master s start condition p stop condition a n acknowledge not acknowledge s slaveaddr 1 a status n p read status (i 2 c read) read 3.5.3. i 2 c i 2 c mode is selected by sel = 1. in i 2 c mode, each command is started as shown in figure x.1. only the number of bytes that is needed for the command has to be s ent. an exception is the hsmode where always 3 byt es must be sent like in spi mode. after the execution of a command (busy = 0) the expected data can be read as illustrated in figure 3.10. or if no data are retur ned by the command the next command can be sent. th e status can be read at any time as described in figure 3.9. figure 3.8 i 2 c command request. figure 3.9 i2c read status.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 28 of 46 s slaveaddr 1 a status a memdat <15:8> a memdat <7:0> n p s slaveaddr 1 a status a bridgedat <15:8> a bridgedat <7:0> n p a tempdat <15:8> a tempdat <7:0> read data (i 2 c read) (a) example: after the completion of a memory read command read (b) example: after the completion of a full measur ement command (ac hex ) read figure 3.10 i 2 c read data. all mandatory i2cbus protocol features are impleme nted. optional features like clock stretching, 10b it slave address, etc., are not supported by the zssc3026s interface. in i2chigh speed mode, a command consists of a fix ed length of three bytes. 3.6. memory in the zssc3026, the memory is organized pagewise and can be programmed multiple (4) times (mtp). eac h register can only be programmed once per page. the valid page is determined by the page counter which can be incremented with the command 5e hex C this leads to a reset of all registers and a r eprogramming is necessary. increasing the customer page counter will disable a ll old register contents of the former page. it is possible to (re)program 4 pages totally. resetting the page co unter is not possible. the page counter starts with 0 and can become 3 at maximum. if the 4 th memory page has been used, no further changes in t he memory are possible C careful writing and page incrementing is strongly r ecommended. there are two mtp page types: ? customer page: accessible by means of regular writ e operations (40 hex to 57 hex ). it contains: icid, interface setup data, measurement setup informat ion, calibration coefficients, etc. ? zmdi page: only accessible for write operations by zmdi. the zmdi page contains specific trim information and is programmed during manufacturi ng test by zmdi. 3.6.1. programming memory programming memory requires a specific supply volta ge level (>2.9v) at vdd pin (see section 1.3 for specifications). the mtp programming voltage itself is generated by means of an implemented charge pum p; no additional, external voltage, other than vdd needed . the program timing is shown in figure 3.11. suppl ying the zssc3026 with vdd>2.9v during memory programming is required. after the memory is programmed, it must be read again to verify the validity of the memory con tent.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 29 of 46 figure 3.11 memory program operation. 3.6.2. memory status commands the 16bit memory status answer for the commands: 2 0 hex to 37 hex and 80 hex to 8e hex contains the following information: ? one bit indicating if the data read was corrected. ? two bits indicating the current page in use. table 3.7 memory status word. bit description 15 (msb) data was corrected (0: no, 1: yes) 14 13 current page 12:0 undefined C do not use
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 30 of 46 3.6.3. memory contents table 3.8 mtp memory content assignments. mtp address word / bit range default setting description notes / explanations 00 hex 15:0 0000 hex cust_id0 customer id byte 0 (combines with memory word 01 hex to form customer id) 01 hex 15:0 0000 hex cust_id1 customer id byte 1 (combines with memory word 00 hex to form customer id) interface configuration 6:0 000 0000 bin slave_addr i2c slave address; valid range: 00 hex to 7f hex (default: 00 hex ), remark: address codes 04 hex to 07 hex reserved for entering i 2 c high speed mode 8:7 00 bin reserved 9 0 bin ss_polarity determines the polarity of the slave select pin (ss) for spi operation: ? 0 slave select is active low (spi & zssc3026 are active if ss==0) ? 1 slave select is active high (spi & zssc3026 are active if ss==1) 11:10 00 bin ckp_cke clock polarity and clockedge selectdetermines polarity and phase of spi interface clock with the following modes: ? 00 sclk is low in idle state, data latch with rising edge and data output with falling edge ? 01 sclk is low in idle state, data latch with falling edge and data output with rising edge ? 10 sclk is high in idle state, data latch with falling edge and data output with rising edge ? 11 sclk is high in idle state, data latch with rising edge and data output with falling edge 02 hex 15:12 not assigned
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 31 of 46 mtp address word / bit range default setting description notes / explanations signal conditioning parameters 0 0 bin offset_b[16] bridge offset, bit[16]functions as the msb and combines with offset_b[15:0] in 05 hex to form the 17bit coefficients absolute value 1 0 bin offset_b_sign sign for sensor bridge offset (offset_b): 0 => a positive value or 1 => a negative value 2 0 bin gain_b[16] bridge gain, bit[16] functions as the msb and combines with gain_b[15:0] in 06 hex to form the 17 bit coefficients absolute value 3 0 bin gain_b_sign sign of the sensor bridge gain (gain_b): 0 => a positive value or 1 => a negative value 4 0 bin tcg[16] 1 st order temperature coefficient of the bridge gain, bit[16] functions as the msb and combines with tcg[15:0] in 07 hex to form 17bit coefficients absolute value 5 0 bin tcg_sign sign off 1 st order temperature coefficient (tcg): 0 => a positive value or 1 => a negative value 6 0 bin tco[16] 1 st order temperature coefficient of the bridge offset , bit[16] functions as the msb and combines with tco[15:0] in 08 hex to form 17bit coefficients absolute value 7 0 bin tco_sign sign of 1 st order temperature coefficient (tco): 0 => a positive value or 1 => a negative value 8 0 bin sot_tco[16] 2 nd order temperature coefficient of the bridge offset , bit[16] functions as the msb and combines with sot_tco[15:0] in 09 hex to form 17bit coefficients absolute value 9 0 bin sot_tco_sign separate setting if 2 nd order temperature coefficient (sot_tco) is: 0 => a positive value or 1 => a negative value 10 0 bin sot_tcg[16] 2 nd order temperature coefficient of the bridge gain, bit[16] functions as the msb and combines with sot_tcg[15:0] in 0a hex to form 17bit coefficients absolute value 03 hex 11 0 bin sot_tcg_sign separate setting (sign) if 2 nd order temperature coefficient (sot_tcg) is: 0 => a positive value or 1 => a negative value
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 32 of 46 mtp address word / bit range default setting description notes / explanations 12 0 bin sot_bridge[16] 2 nd order coefficient of the bridge signal, bit[16] functions as the msb and combines with sot_bridge[15:0] in 0b hex to form 17bit coefficients absolute value 13 0 bin sot_bridge_sign separate setting if 2 nd order bridge coefficient (sot_bridge) is 0 => a positive value or 1 => a negative value 14 0 bin sot_curve type of second order curve correction for the bridg e sensor signal. 0 parabolic curve 1 sshaped curve 15 0 bin tsetl_sign separate setting t_setl is 0 => a positive value or 1 => a negative value 0 0 bin gain_t[16] temperature gain of temperature sensor, bit[16] functions as the msb and combines with gain_t[15:0] in 0d hex to form 17bit coefficients absolute value 1 0 bin gain_t_sign separate setting if the temperature gain (gain_t) is : 0 => a positive value or 1 => a negative value 2 0 bin sot_t[16] 2 nd order temperature coefficient of temp. sensor, bit[16] functions as the msb and combines with sot_t[15:0] in 0e hex to form 17bit coefficients absolute value 3 0 bin sot_t_sign separate setting if 2 nd order temperature coefficient (sot_t) is 0 => a positive value or 1 => a negative value 4 0 bin offset_t[16] temperature offset of temp. sensor, bit[16] functio ns as the msb and combines with offset_t[15:0] in 0c hex to form 17bit coefficients absolute value 5 0 bin offset_t_sign separate setting if the temperature offset (offset_t ) is 0 => a positive value or 1 => a negative value 04 hex 15:6 0 0000 000 0 bin not assigned
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 33 of 46 mtp address word / bit range default setting description notes / explanations 05 hex 15:0 0000 hex (7000 hex ) offset_b[15:0] bits [15:0] of the bridge offset correction coeffici ent, which is an 18bit wide absolute value (the respective msbs offset_b[16] and sign, offset_b_sign, are under bits[1:0] in 03 hex ) [1/16 to 15/16] = 7000 hex (default for volume) [2/16 to 14/16] = 6000 hex [3/16 to 13/16] = 5000 hex [4/16 to 12/16] = 4000 hex [5/16 to 11/16] = 3000 hex [6/16 to 10/16] = 2000 hex [7/16 to 9/16] = 1000 hex [8/16 to 8/16] = 0000 hex (default for prototypes) 06 hex 15:0 0000 hex (8000 hex ) gain_b[15:0] bits[15:0] of 17bit wide absolute value of the brid ge gain coefficient (default for prototypes: 0000 hex ; default for volume production: 8000 hex the respective msbs, gain_b[16] and sign, gain_b_sign, are under bits[3:2] in 03 hex ) 07 hex 15:0 0000 hex tcg[15:0] coefficient for temperature correction of the bridg e gain term C the respective msbs, tcg[16] and sign, tcg_sign, are under (bits[5:4] in 03 hex ) 08 hex 15:0 0000 hex tco[15:0] coefficient for temperature correction of the bridg e offset term C the respective msbs, tco[16] and sign, tco_sign, are under (bits[7:6] in 03 hex ) 09 hex 15:0 0000 hex sot_tco[15:0] 2 nd order term applied to tco C the respective msbs, sot_tco[16] and sign, sot_tco_sign, are under (bits[9:8] in 03 hex ) 0a hex 15:0 0000 hex sot_tcg[15:0] 2 nd order term applied to tcg. C the respective msbs, sot_tcg[16] and sign, sot_tcg_sign, are under (bits[11:10] in 03 hex ) 0b hex 15:0 0000 hex sot_bridge[15:0] 2 nd order term applied to the sensor bridge readout C the respective msbs, sot_bridge[16] and sign, sot_bridge_sign are under (bits[13:12] in 03 hex ) 0c hex 15:0 0000 hex (7000 hex ) offset_t[15:0] bits [15:0] of the temperature offset correction coefficient (the respective msbs, offset_t[16] and sign, offset_t_sign, are under (bits[5:4] in 04 hex ) [1/16 to 15/16] = 7000 hex (default for volume) [2/16 to 14/16] = 6000 hex [3/16 to 13/16] = 5000 hex [4/16 to 12/16] = 4000 hex [5/16 to 11/16] = 3000 hex [6/16 to 10/16] = 2000 hex [7/16 to 9/16] = 1000 hex [8/16 to 8/16] = 0000 hex (default for prototypes) 0d hex 15:0 0000 hex (8000 hex ) gain_t[15:0] bits [15:0] of the absolute value of the temperature gain coefficient (default for prototypes: 0000 hex ; default for volume production: 8000 hex the respective msbs, gain_t[16] and sign, gain_t_sign, are under bits[1:0] in 04 hex )
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 34 of 46 mtp address word / bit range default setting description notes / explanations 0e hex 15:0 0000 hex sot_t[15:0] 2 nd order term applied to the temperature reading C the respective msbs, sot_t[16] and sign, sot_t_sign, are under (bits[3:2] in 04 hex ) 0f hex 15:0 0000 hex t_setl stores raw temperature reading at the temperature at which low calibration points were taken measurement configuration register ( bm_config ) 1:0 00 bin gain_stage1 gain setting for the 1 st premp stage with gain_stage1: ? 00 12 ? 01 20 ? 10 30 ? 11 40 4:2 000 bin gain_stage2 gain setting for the 2 nd preamp stage with gain_stage2: ? 000 1.1 ? 001 1.2 ? 010 1.3 ? 011 1.4 ? 100 1.5 ? 101 1.6 ? 110 1.7 ? 111 1.8 5 0 bin gain_polarity set up the polarity of the sensor bridges gain (inverting of the chopper) with ? 0 positive (no polarity change) ? 1 negative (180 polarity change ) 7:6 00 bin (11 bin ) msb absolute number of bits for the msb conversion in the adc with msb: ? 00 10bit ? 01 12bit ? 10 14bit ? 11 16bit 10 hex 9:8 00 bin lsb absolute number of bits for the lsb conversion in the adc with lsb: ? 00 0bit (single stage cb_adc) ? 01 2bit ? 10 4bit ? 11 6bit
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 35 of 46 mtp address word / bit range default setting description notes / explanations 12:10 000 bin a2d_offset adc offset and resulting a2d input range [vref] wit h a2d_offset: ? 000 1/16 results in range [1/16, 15/16] ? 001 2/16 results in range [2/16, 14/16 ? 010 3/16 results in range [3/16, 13/16] ? 011 4/16 results in range [4/16, 12/16] ? 100 5/16 results in range [5/16, 11/16] ? 101 6/16 results in range [6/16, 10/16] ? 110 7/16 results in range [7/16, 9/16] ? 111 8/16 results in range [8/16, 8/16] 14:13 00 bin temp_adc selection between fixed adc segmentations for temperature measurements: ? 00 setup according to zmdireserved memory (recommended setup for best performance and speed tradeoff) ? 01 msb=16, lsb=0 (16bit) ? 10 msb=10, lsb=6 (16bit) ? 11 msb=12, lsb=4 (16bit) 15 0 bin reserved 11 hex not assigned 12 hex not assigned 13 hex not assigned 14 hex not assigned 15 hex not assigned 16 hex not assigned 17 hex 15:0 checksumc generated (checksum) for user page through a linear feedback shift register (lfsr); signature is checked with powerup to ensure memory content integrity the memory integrity checksum is generated through a linear feedback shift register with the polynomia l: g(x) = x 16 + x 15 + x 2 + 1 with the initialization value: ffff hex .
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 36 of 46 3.7. calibration sequence calibration essentially involves collecting raw sig nal and temperature data from the sensoric system for different known bridge values and temperatures. this raw data can then be processed by the calibration master (a ssumed to be a pc), and the calculated calibration coeffic ients can then be written to mtp memory. below is a brief overview of the steps involved in calibrating the z ssc3026. there are three main steps to calibration: 1. assigning a unique identification to the zssc3026. this identification is written to shadow ram and l ater programmed in mtp memory. this unique identificatio n can be stored in the two 16bit registers dedicated to customer id. it can be used as an inde x into a database stored on the calibration pc. thi s database will contain all the raw values of bridge readings and temperature readings for that part, as well as the known bridge measurand conditions and temper ature to which the bridge was exposed. 2. data collection. data collection involves getting uncorrected or ra w data from the bridge at different known measurand values and temperatures. then this data is stored on the calibration pc using the unique identification of the device as the index to the database. 3. coefficient calculation and storage in mtp memory. after enough data points have been collected to calculate all the desired coefficients, the coeffic ients can be calculated by the calibrating pc and w ritten to the shadow ram. after that, mtp memory is progra mmed with the contents of the shadow ram. 4. result . the sensor signal and the characteristic temperat ure effect on output will be linearized according to the setupdependent maximum output range. it is essential to perform the calibration with a f ixed programming setup during the data collection p hase. in order to prevent any accidental misprocessing, it is furt her recommended to keep the mtp memory setup stable during the whole calibration process as well as in the sub sequent operation. a zssc3026 calibration only fits the single setup used during its calibration. changes of funct ional parameters after a successful calibration can decrease the precision and accuracy performance of the zssc3 026 as well as of the whole application. 3.7.1. calibration step 1 C assigning unique identi fication assign a unique identification number to the zssc30 26 by using the memory write command (40 hex + data and 41 hex + data; see table 3.1 and table 3.8) to write the identification number to cust_id0 at memory address 00 hex and cust_id1 at address 01 hex as described in section 3.6.1. these two 16bit re gisters allow for more than 4 trillion unique devices. 3.7.2. calibration step 2 C data collection the number of unique points (measurand and/or tempe rature) at which calibration must be performed gene rally depends on the requirements of the application and the behavior of the resistive bridge in use. the mi nimum number of points required is equal to the number of bridge coefficients to be corrected with a minimum of three different temperatures at three different bridge va lues. for a full calibration resulting in values fo r all 7 possible bridge coefficients and 3 possible temperature coef ficients, a minimum of 7 pairs of bridge with tempe rature measurements must be collected.. within this minimum 3x3 measurements field, data mu st be collected for the specific value pairs (at kn own conditions) and then processed to calculate the coe fficients. in order to obtain the potentially best and most robust coefficients, it is recommended that measurement pa irs (temperature vs. pressure) be collected at the outer corners of the intended operation range or at least at points which are located far from each other. i t is also essential to provide highly precise reference value s as nominal, expected values. the measurement prec ision of the external calibrationmeasurement equipment shou ld be ten times more accurate than the expected zssc3026 output precision after calibration in orde r to avoid precision losses caused by the nominal r eference values (e.g., pressure signal and temperature devia tions).
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 37 of 46 note: an appropriate selection of measurement pairs can significantly improve the overall system perfo rmance. the determination of the measurandrelated coeffici ents will use all of the measurement pairs. for the temperaturerelated correction coefficients, 3 (at three different temperatures) of the e.g. 7 measure ment pairs will be used. note: there is an inherent redundancy in the 7 brid ge-related and 3 temperature-related coefficients. since the temperature is a necessary output (which also needs correction), the temperature-related information i s mathematically separated, which supports faster and more efficient dsp calculations during the normal usage of the sensor-ic system. the recommended approach for data collection is to make use of the rawmeasurement commands: ? for bridge sensor values: o a2 hex + 0000 hex : single bridge measurement whereas the configuration register will be loaded from the bm_config register (10 hex in mtp); preprogramming the measurement setup in the mtp is required. o a3 hex + ssss hex : single bridge measurement whereas the bm_config configuration register (gain, adc, offset, etc.) will be loaded as sss s hex and must be provided externally via the interface. ? for temperature values: o a6 hex + 0000 hex : single temperature measurement whereas the configur ation register will be loaded from an internal temperature configurati on register (preprogrammed by zmdi in mtp); preprogramming of the respective configuration is done by zmdi prior to ic delivery. this is the recommended a pproach for temperature data collection. o a7 hex + ssss hex : single temperature measurement whereas the confi guration register (gain, adc, offset, etc.) will be loaded as sss s hex and must be provided externally via the interface. the data composit ion of the temperature configuration register is similar to the bm_con fig (address 10 hex ) register for the bridge sensor. 3.7.3. calibration step 3 C coefficient calculation s the math to perform the coefficient calculation is complicated and will not be discussed in detail. th ere is a brief overview in the next section. zmdi will provide sof tware (dlls) to perform the coefficient calculation (external to the sensoric system) based on autozero corrected values. after the coefficients are calculated, the final step is to write them to the mtp memory of the zssc3026. 3.8. the calibration math 3.8.1. bridge signal compensation the saturation check in the zssc3026 is enhanced co mpared with older sscs from zmdi. even saturation effects of the internal calculation steps are detec ted, even though the final correction output will s till be determined. it is possible to get seemingly useful signal conditioning results which have seen an inte rmediate saturation during the calculations C these cases ar e detectable by observing the status bit[0] for eac h measurement result. details about the saturation li mits and the valid ranges for values are provided i n the following equations.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 38 of 46 sot_curve selects whether secondorder equations compensate for sensor nonlinearity with a parabolic or sshaped curve. the parabolic compensation is recom mended. the correction formula for the differential signal reading is represented as a twostep process depend ing on the sot_curve setting. equations for the parabolic sot_curve setting ( sot_curve = 0): simplified: setl t raw t t ? = _ (5) ?? ? ?? ? + ? ? + = tcg t tcg sot t k 15 15 15 1 2 _ 2 2 (6) ?? ? ?? ? + ? ? + + = tco t tco sot t raw br b offset k 15 15 2 2 _ 2 _ _ (7) 15 2 15 1 15 2 2 2 _ + ? ? = k k b gain z bp (delimited to positive number range) (8) ?? ? ?? ? + ? ? = 15 15 15 2 2 _ 2 bp bp z bridge sot z b (delimited to positive number range) (9) complete: [ ] 1 2 2 17 17 _ ? ? ? = setl t raw t t (10) 1 2 2 1 2 2 1 2 2 1 2 2 15 15 15 1 17 17 17 17 17 17 17 17 2 _ 2 2 ? ? ? ? ? ? ? ? ? ? ? ?? ? ? ? ? ?? ? ? ? ?? ? ? ? ?? ? ? ?? ? ? ?? ? + ?? ? ?? ? ? ? + = tcg t tcg sot t k (11) 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 15 15 2 17 17 17 17 17 17 17 17 17 17 2 _ 2 _ _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?? ? ? ? ? ? ?? ? ? ? ? ?? ? ? ? ? ?? ? ? ? ?? ? ? ? ?? ? ? ?? ? ? ?? ? + ?? ? ?? ? ? ? + + = tco t tco sot t raw br b offset k (12) 1 2 0 15 1 2 2 1 2 2 2 15 1 15 17 17 17 17 17 2 2 2 _ ? ? ? ? ? ? ? ?? ? ? ? ?? ? + ? ?? ? ? ?? ? ?? ? ?? ? ? ? = k k b gain z bp (13) 1 2 0 1 2 2 15 1 2 2 15 15 16 17 17 17 17 2 2 _ 2 ? ? ? ? ? ? ? ?? ? ? ? ?? ? ? ?? ? ? ?? ? + ?? ? ?? ? ? ? = bp bp z bridge sot z b (14)
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 39 of 46 equations for the s-shaped sot_curve setting ( sot_curve = 1): simplified: 2 15 1 15 2 2 _ k k b gain z bs ? ? = (15) 15 15 15 15 2 2 2 _ 2 + ?? ? ?? ? + ? ? = bs bs z bridge sot z b (delimited to positive number range) (16) complete: 1 2 2 1 2 2 2 15 1 15 17 17 17 17 2 2 _ ? ? ? ? ? ?? ? ? ?? ? ?? ? ?? ? ? ? = k k b gain z bs (17) 16 17 17 17 17 17 17 2 0 15 1 2 2 1 2 2 15 1 2 2 15 15 2 2 2 _ 2 ? ? ? ?? ? ? ? ? ?? ? + ? ? ?? ? ? ? ?? ? ? ?? ? ? ?? ? + ?? ? ?? ? ? ? = ? ? ? ? ? ? bs bs z bridge sot z b (18) where b = corrected bridge reading output via i 2 c or spi; range [0 hex .. ffff hex ]; br_raw = raw bridge reading from adc after az correction; range [1ffff hex .. 1ffff hex ]; gain_b = bridge gain term; range [1ffff hex .. 1ffff hex ]; offset_b = bridge offset term; range [1ffff hex .. 1ffff hex ]; tcg = temperature coefficient gain term; range [1fff f hex .. 1ffff hex ]; tco = temperature coefficient offset term; range [1ff ff hex .. 1ffff hex ]; t_raw = raw temperature reading after az correction; ra nge [1ffff hex .. 1ffff hex ]; t setl = t_raw reading at which low calibration was perfo rmed (e.g. 25c); range [ffff hex .. ffff hex ]; sot_tcg = secondorder term for tcg nonlinearity; range [ 1ffff hex .. 1ffff hex ]; sot_tco = secondorder term for tco nonlinearity; range [ 1ffff hex .. 1ffff hex ]; sot_bridge = secondorder term for bridge nonlinearity; rang e [1ffff hex .. 1ffff hex ]; k = absolute value; [ ] ulll k = bound/saturation number range from ll to ul , over/underflow is reported as saturation in status byte.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 40 of 46 3.8.2. temperature signal compensation temperature is measured internally. temperature cor rection contains both linear gain and offset terms as well as a secondorder term to correct for any nonlineariti es. for temperature, secondorder compensation for nonlinearity is always parabolic. again, the correc tion formula is best represented as a twostep proc ess as follows: simplified: ( ) 15 15 2 _ _ 2 _ + + ? = t offset raw t t gain z t (delimited to positive number range) (19) ?? ? ?? ? + ? ? = 15 15 15 2 2 _ 2 t t z t sot z t (delimited to positive number range) (20) complete: [ ] 1 2 0 15 1 2 2 1 2 2 15 17 17 17 17 17 2 _ _ 2 _ ? ? ? ? ? ? ?? ? ? ?? ? + ?? ? ?? ? + ? = t offset raw t t gain z t (21) 1 2 0 1 2 2 15 1 2 2 15 15 16 17 17 17 17 2 2 _ 2 ? ? ? ? ? ? ? ?? ? ? ? ?? ? ? ?? ? ? ?? ? + ?? ? ?? ? ? ? = t t z t sot z t (22) where gain_t = gain coefficient for temperature; range [1ffff hex .. 1ffff hex ]; t_raw = raw temperature reading after az correction; ran ge [1ffff hex .. 1ffff hex ]; offset_t = offset coefficient for temperature; range [1fff f hex .. 1ffff hex ]; sot_t = secondorder term for temperature source nonline arity; range [1ffff hex .. 1ffff hex ]
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 41 of 46 4 die dimensions and pin assignments the zssc3026 is available in die form (chip size wi th scribe line: 1.5mm 2 see figure 4.1 for additional dimensions.), as bumped die and in pqfn24 4x4 packa ge. in figure 4.1, the shown outer dimensions are estim ations for a die after sawing with remaining scribe line silicon of ca. 20um around the core die. thus, the effectiv e outer dimensions may differ slightly. figure 4.1 zssc3026 pad placement. table 4.1 die size & geometry. parameter min [um] typ [um] description / remarks xdimension 900 925 ydimension 1560 1585 including seal ring and remaining empty silicon a fter sawing; maximum dimensions may be larger for engineering samples due to wider scribe lines 79.5 80 passivation window opening effective area for bon d connection bondpad size (x & y) 60 60 valid only for two special pads: vdd2, eoc2 being shorted with vdd and eoc, respectively minimum pitch for application relevant pads 200 centertocenter distance; there are further pads, which are only for zmdis test purposes die size adder beyond seal ring 0 40 potentially remaining silicon after die sawing sawing lane 80 die to die distance
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 42 of 46 table 4.2 pin assignments. name direction type description vdd1 ic positive supply voltage for the ic, regular bond pad vdd2 in supply ic positive supply voltage for the ic, special pad (electrically connected to vdd1, also bondable) vss in supply ground reference voltage signal vssb out analog negative bridge supply (bridge sens or ground) vddb out analog positive bridge supply inp in analog positive bridge signal inn in analog negative bridge signal eoc1 end of conversion, regular bond pad eoc2 out digital end of conversion, special pad (electrically connect ed to eoc1, also bondable) sel in digital i2c or spi interface select sclk/scl in digital clock input for i2c/spi mosi/sda in/out digital data input for spi; data in/o ut for i2c miso out digital data output for spi ss in digital slave select for spi zmditest do not connect to these pads
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 43 of 46 4.1. package (pqfn24) properties figure 4.2 general pqfn24 package dimensions. table 4.3 physical package dimensions extrema. parameter / dimension min [mm] max [mm] a 0.80 0.90 a 1 0.00 0.05 b 0.18 0.30 e 0.5nom h d 3.90 4.10 h e 3.90 4.10 l 0.35 0.45
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 44 of 46 table 4.4 pin assignments pqfn24. pin no. name *) direction type description 1 vss in supply ground reference voltage signal 2 vssb out supply sensor bridge's ground 3 zmditest do not connect 4 inn in analog negative bridge signal 5 zmditest do not connect 6 vddb out supply sensor bridges supply (driven from the ic), remark: do not short with vdd! 7 inp in analog positive bridge signal 8 zmditest do not connect 9 n.c. 10 n.c. 11 sclk/scl in digital clock input for i2c / spi 12 mosi/sda in / out digital data input for spi, data in/outline for i2c 13 zmditest do not connect 14 miso in digital data output for spi 15 zmditest do not connect 16 ss in digital slave select for spi 17 zmditest do not connect 18 sel in digital i2c or spi interface select (internal pull up, 0spi, 1i2c) 19 eoc out digital end of conversion can be used as measurement completed trigger 20 n.c. 21 n.c. 22 n.c. 23 n.c. 24 vdd in supply ics supply voltage *) n.c. stands for not connected / no connection r equired / not bonded 5 quality and reliability the zssc3026 is available as consumer and indust rial qualified ic version. for the consumer versio n, all data sheet parameters are guaranteed if not stated other wise. additionally the mtps data retention capability (o ver ten years, cp. table 1.4) is guaranteed for the industrial ic version.
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 45 of 46 6 related documents document file name zssc3026 feature sheet zssc3026_featuresheet_v*.pdf zssc3026 application note: application circuits zssc3026_applicationcircuit_v*.pdf zssc30x6 evaluation kit documentation zssc30x6_evaluationkit_v*.pdf zssc30x6 application note: calibration zssc30x6_calibration_v*.pdf visit zmdis website www.zmdi.com or contact your nearest sales office for ordering information or the latest version of these documents. 7 glossary term description a2d analogtodigital ack acknowledge (interfaces protocol indicator for successful data/command transfer) adc analogtodigital converter or conversion az autozero (unspecific) azs autozero measurement for sensor bridge path azt autozero measurement for temperature path clk clock dac digitaltoanalog conversion or converter df data fetch (this is a command type) dsp digital signal processor (digital configuration , calibration, calculation, communication unit) fso full scale output (value in percent relative to the adc maximum output code; resolution dependent) lsb least significant bit (fine portion of the co nverted signal) lfsr linear feedback shift register mr measurement request (this is a command type) msb most significant bit (coarse portion of the c onverted signal) nack not acknowledge (interfaces protocol indicato r for unsuccessful data/command transfer) por poweron reset preamp preamplifier sm signal measurement sot secondorder term tc temperature coefficient (of a resistor or the eq uivalent bridge resistance) tm temperature measurement
zssc3026 low power 16 bit sensor signal conditioner ic data sheet may 15, 2012 ? 2012 zentrum mikroelektronik dresden ag rev. 1 .02 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. t he information furnished in this publication is subject to changes without notice. 46 of 46 8 document revision history revision date description 1.00 january 06, 2012 first release official of dat a sheet 1.01 march 28, 2012 change of esd limit to 4kv, addit ional bump information, reset conditions added 1.02 may 15, 2012 included adjustments for temperat ure capabilities up to 110c sales and further information www.zmdi.com sales@zmdi.com zentrum mikroelektronik dresden ag (zmd ag) grenzstrasse 28 01109 dresden germany zmd america, inc. 8413 excelsior drive suite 200 madison, wi 53717 usa zmd ag, japan office 2nd floor, shinbashi tokyu bldg. 4213, shinbashi, minatoku tokyo, 1050004 japan zmd far east, ltd. 3f, no. 51, sec. 2, keelung road 11052 taipei taiwan phone +49 (0)351.8822.7.772 fax +49(0)351.8822.87.772 phone +01 (608) 8291987 fax +01 (631) 5492882 phone +81.3.6895.7410 fax +81.3.6895.7301 phone +886.2.2377.8189 fax +886.2.2377.8199 disclaimer : this information applies to a product under devel opment. its characteristics and specifications are preliminary and subject to change without notice. z entrum mikroelektronik dresden ag (zmd ag) assumes no obli gation regarding future manufacture unless otherwis e agreed to in writing. the information furnished h ereby is believed to be true and accurate. however, under no circumstances shall zmd ag be liable to any customer, licensee, or any other third party for any special, indirect, incid ental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. zmd ag hereby expressly disclaims any liability of zmd ag to any customer, licensee or any other third party, and any such customer, licensee and any other thir d party hereby waives any liability of zmd ag for a ny damages in connection with or arising out of the furnishing, performance or use o f this technical data, whether based on contract, w arranty, tort (including negligence), strict liabil ity, or otherwise.
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